RFY

AT&S Package C18B

Scope of Work

Design, engineering, supply, fabrication and installation of façade works

Location

Kulim, Malaysia

Year

2023

Architect

BYG Architects

Project Size

14,800 m² 

AT&S Package C18B

AT&S, one of the globally leading manufacturers of high-end printed circuit boards and IC substrates, headquartered in Austria (Europe), sets up a state-of-the-art factory for IC substrates at the Kulim Hi-Tech Park, Kedah. This new campus for the production of IC substrates introduces construction of production facilities, warehouses and administration building as its phase 1 development.
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